Dynalene wins OCP Accepted status for data center coolant

Dynalene has earned Open Compute Project Accepted status for PG-D25, a coolant built for direct-to-chip cooling in data centers and AI infrastructure. The recognition signals that the product meets OCP standards for efficiency, openness, scale and sustainability.

Why it matters: - OCP Accepted status can help data center buyers identify coolant products that meet an industry-backed specification for liquid cooling. - The designation matters as operators push for better energy efficiency, higher rack density and more sustainable cooling for AI and high-performance computing systems. - Dynalene’s recognition adds another approved option to a market moving faster toward direct-to-chip cooling.

What happened: - Dynalene said August 12, 2026, that its Dynalene PG-D25 coolant has been recognized under the Open Compute Project Accepted program. - The coolant is designed for direct-to-chip cooling. - The announcement was made from Whitehall, Pennsylvania. - Dynalene said the milestone strengthens its focus on sustainable and efficient liquid cooling for data centers and high-performance computing.

The details: - The Open Compute Project is a group that shares data center design ideas and best practices across companies. - OCP was founded in 2011, and the group said more than 650 companies were members as of 2026. - The OCP Product Recognition Program formally recognizes products aligned with OCP-approved contributions. - OCP Accepted status means a product complies with an approved OCP specification and aligns with OCP’s core principles of efficiency, openness, impact, scale and sustainability. - Dynalene PG-D25 uses USP-grade propylene glycol and a proprietary additive package. - The coolant is built to protect multi-metal systems, especially copper cold plates and heat exchangers used in many coolant distribution units. - Dynalene says the fluid also resists algae and bacteria growth. - The product passes ASTM tests for heat transfer coolants (D8040), thermal stability (D7437) and coolant foaming (D1881). - Dynalene says its liquid cooling systems can improve Power Usage Effectiveness and increase rack density. - The company said it has delivered multiple large global orders of up to 1 million gallons per project for data center and other applications. - More information is available in the Open Compute Project Product Recognition Program and on Dynalene’s website.

Between the lines: - The recognition gives Dynalene third-party validation in a category where standards and interoperability matter to large operators. - The focus on direct-to-chip cooling reflects the industry’s shift toward liquid cooling as AI workloads drive hotter and denser server environments. - Dynalene is positioning PG-D25 as both a technical fit and a scale-ready supply option.

What's next: - Dynalene plans to keep building its data center cooling portfolio and participating in the OCP community. - Data center operators looking at liquid cooling will likely see more pressure to adopt products that align with OCP-recognized specifications. - The company’s next test is turning the recognition into broader adoption across new deployments.